In general, copper is used as the substrate under nickel electroplateto improve the adhesion of the plate. Copper adheres stronly to steel, and nickel adheres strongly to copper, but nickel does not adhere well to steel. Accordingly, conventional plating processes would apply a"strike", or thin coating of copper using high current density-low bath concentration techniques to improve the adhesion of the copper to the steel. Then a low current-high bath concentration nickel process would be used to deposit the overcoat of nickel. Electroplating is a relatively rapid process, so parts can be finished expeditiously and at relatively low cost.
Electroless nickel plating, on the other hand, is a pure chemical process where the bath concentration, temperature and time of immersion control the plate thickness. Electroless (EN) platining is a much slower process, depositing plate at the approximate rate of 0.001"/hr at 190 degrees. While EN plate is very tightly adhering, and can withstand bendind through a tight radius without separating from the substrate, the process controll requirements are rigourous, and the cost of the deposited coating is significantly higher than production electroplate. In general, electroplated finishes are used with brightners to make the finish "sparkle" while EN plate is not as shiny without a post-plate polish (= additional cost).